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RT7322 ? ds7322-00 march 2014 www.richtek.com 1 ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. linear led driver for high-voltage led lamps general description the RT7322 is a simple and robust constant-current regulator designed to provide a cost-effective solution for driving high-voltage leds in led lamp applications. the RT7322 is equipped with a proprietary control mechanism to improve the utilization of high-voltage leds. the RT7322 allows users to set the regulated current levels (wqfn- 20l 5x5 package) for various led lamps. it also provides low pin-count sop-8 (exposed pad) package with customized current setting to meet various application requirements. in addition, the RT7322 also provides a thermal regulation protection, instead of traditional thermal shutdown, to suppress the rise of the temperatures in led lamps and prevent the led lamps from flicker. applications ? high-voltage led lamps features ? ? ? ? ? ac input voltage range : 90 to 130v rms ? ? ? ? ? no electrolytic capacitor and transformer required ? ? ? ? ? improved led utilization ? ? ? ? ? programmable led current ? ? ? ? ? thermal regulation protection ? ? ? ? ? high power efficiency ? ? ? ? ? high power factor ? ? ? ? ? easy emi solution ? ? ? ? ? minimized bom cost and space required ? ? ? ? ? rohs compliant and halogen free for sop-8 (exposed pad) package for wqfn-20l 5x5 package s3 gnd RT7322 hv1 ac s4 hv s1 s2 s3 i32 RT7322 hv1 s4 hv s1 s2 i11 i12 i13 i23 i22 i31 i33 i34 i21 ac gnd marking information for marking information, contact our sales representative directly or through a richtek distributor located in your area. simplified application circuit
RT7322 2 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. pin configurations (top view) sop-8 (exposed pad) wqfn-20l 5x5 hv1 s3 s4 gnd hv s1 nc s2 gnd 2 3 4 5 6 7 8 9 21 gnd hv nc hv1 nc i23 i34 i21 i22 nc i33 15 14 13 12 1 2 3 4 11 5 s3 s4 i32 i31 s2 i11 i12 i13 nc s1 78910 19 18 17 16 6 20 ordering information note : richtek products are : ? rohs compliant and compatible with the current require- ments of ipc/jedec j-std-020. ? suitable for use in snpb or pb-free soldering processes. RT7322xygsp parallel current (i p_s1/2 and i p_s3/4 ) code (x) series current (i s_s3/4 ) code (y) 20ma a 20ma a 25ma b 25ma b 30ma c 30ma c 35ma d 35ma d 40ma e 40ma e 45ma f 45ma f 50ma g 55ma h 60ma i 65ma j 70ma k 75ma l 80ma m 85ma n 90ma o RT7322 version table RT7322 lead plating system g : green (halogen free and pb free) package type sp : sop-8 (exposed pad-option 2) qw : wqfn-20l 5x5 (w-type) RT7322 version table (only for sop-8 (exposed pad))
RT7322 3 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. functional pin description pin no. pin name pin function 1 hv1 controlled high-voltage output. a built-i n high-voltage transistor, connected between the hv and hv1 pins, controls t he on or off of the supply voltage to the external high-voltage led connected with hv1 pin. 2 s3 output of the s3 current regulator. the regulated sinking current is set by the internal bounding wires and depends on the requests of users. in the ?parallel operation?, the current (i p_s3 ) can be set from 20ma to 45ma; in the ?series operation?, the current (i s_s3 ) can be set from the i p_s3 to 90ma. 3 s4 output of the s4 current regulator. like t he s3 pin, the typical regulated currents (i p_s3 and i p_s4 ; i s_s3 and i s_s4 ) of s3 and s4 pins are the same, respectively. 4, 9 (exposed pad) gnd ground. connect this pin to system ground with lowest impedance. the exposed pad must be soldered to a large pcb and connected to gnd for maximum power dissipation. 5 nc no internal connection. 6 s2 output of the s2 current regulator. this pin only regulates the sinking current (i p_s2 ) in the ?parallel operation?. the current (i p_s2 ), set by the internal bounding wires, is in the range of 20ma to 45ma and depends on the requests of users. 7 s1 output of the s1 current regulator. like t he s2 pin, the typical regulated currents (i p_s1 and i p_s2 ) of s1 and s2 pins are the same. 8 hv high-voltage and bias voltage input. connect this pin to the rectified voltage from ac input. for sop-8 (exposed pad) package for wqfn-20l 5x5 package pin no. pin name pin function 1 hv high-voltage input. connect this pin to the rectified voltage from ac input. 2, 4, 5, 6 nc no internal connection. 3 hv1 controlled high voltage output. a built-in high-voltage transistor, connected between the hv and hv1 pins, controls the on or off of the supply voltage to the external high-voltage led connected with hv1 pin. 7 s3 output of the s3 current regulator. the regulated sinking currents (i p_s3 and i s_s3 ) are easily programmed by users. in the ?parallel operation?, the current (i p_s3 ) can be set from 20ma to 45ma by using the i21 to i23 pins; in the ?series operation?, the current (i s_s3 ) can be set from the i p_s3 to 90ma by using the i31 to i34 pins. to directly connect the i21/i31, i22/i32, i23/i33 or i34 pin to gnd pin, respectively increases the sinking cu rrent by 5ma, 10ma 20ma or 40ma. the initial i p_s3 is 20ma if the i21 to i23 pins are open. 8 s4 output pin of the s4 current regulator. like the s3 pin, the typical regulated currents (i p_s3 and i p_s4 ; i s_s3 and i s_s4 ) of s3 and s4 pins are the same and easily programmed by using the i21 to i23 pins and i31 to i34 pins, respectively. 9 i32 current setting input for s3 and s4 pins. if this pin is directly connected to gnd, the regulated currents (i s_s3 and i s_s4 ) increase 10ma (typ.). 10 i31 current setting input for s3 and s4 pins. if this pin is directly connected to gnd, the regulated currents (i s_s3 and i s_s4 ) increase 5ma (typ.).
RT7322 4 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. pin no. pin name pin function 11 i33 current setting input pin for s3 and s4 pins . if this pin is directly connected to gnd, the regulated currents (i s_s3 and i s_s4 ) increase 20ma (typ.). 12 i34 current setting input pin for s3 and s4 pins . if this pin is directly connected to gnd, the regulated currents (i s_s3 and i s_s4 ) increase 40ma (typ.). 13 i21 current setting input for s3 and s4 pins. if this pin is directly connected to gnd, the regulated currents (i p_s3 and i p_s4 ) increase 5ma (typ.). 14 i22 current setting input for s3 and s4 pins. if this pin is directly connected to gnd, the regulated currents (i p_s3 and i p_s4 ) increase 10ma (typ.). 15 i23 current setting input pin for s3 and s4 pins . if this pin is directly connected to gnd, the regulated currents (i p_s3 and i p_s4 ) increase 20ma (typ.). 16 i13 current setting input for s1 and s2 pins. if this pin is directly connected to gnd, the regulated currents (i p_s1 and i p_s2 ) increase 20ma (typ.). 17 i12 current setting input for s1 and s2 pins. if this pin is directly connected to gnd, the regulated currents (i p_s1 and i p_s2 ) increase 10ma (typ.). 18 i11 current setting input for s1 and s2 pins. if this pin is directly connected to gnd, the regulated currents (i p_s1 and i p_s2 ) increase 5ma (typ.). 19 s2 output of the s2 current regulator. this pin only regulates the sinking current (i p_s2 ) in the ?parallel operation?. to open or directly connect the i11, i12 or i13 pin to gnd pin can easily program the sinking current from 20ma to 45ma by users. 20 s1 output of the s1 current regulator. like the s2 pin, the typical regulated currents (i p_s1 and i p_s2 ) of s1 and s2 pins are the same. 21 (exposed pad) gnd ground. the exposed pad must be soldered to a large pcb and connected to gnd for maximum power dissipation.
RT7322 5 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. function block diagram for sop-8 (exposed pad) package for wqfn-20l 5x5 package s1 s2 hv hv1 m5 thermal regulation protection voltage regulator v reg d1 s1 current regulator s2 current regulator on/off and parallel/series controls on_s1 s3 s4 s3 current regulator s4 current regulator on_s2 on_s3 on_s4 v s2 v s4 parallel v ref v ref1 gnd s1 s2 hv hv1 m5 thermal regulation protection voltage regulator v reg d1 s1 current regulator s2 current regulator on/off and parallel/series controls on_s1 s3 s4 s3 current regulator s4 current regulator on_s2 on_s3 on_s4 v s2 v s4 parallel v ref v ref1 gnd i22 i21 i13 i12 i11 i33 i32 i31 i23 current setting for s1 and s2 i 11 i 12 i 13 i 10 i 21 i 22 i 23 i 20 i 31 i 32 i 33 5ma 10ma 20ma 20ma 5ma 10ma 20ma 20ma 5ma 10ma 20ma parallel i34 i 34 40ma current setting for s3 and s4 : i 20 , i 21 to i 23 are used in pa rallel operation i 20 , i 21 to i 23 , i 31 to i 34 are used in series operation i s1 i s2 i s3 i s4
RT7322 6 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. operation constant-current regulator in figure 1, each constant-current regulator in the RT7322 consists of an output high-voltage mosfet, programmable current-sense resistors, an error amplifier and a reference voltage (v ref ). sx m1 error amplifier v ref ix1 v reg programmable current-sense resistors ix3 v cs + - figure 1 the error amplifier, designed with high dc gain, compares the current signal (v cs ) on the current-sense resistors and the v ref to generate an amplified error signal. the error signal regulates the output mosfet (m1) to control the sinking current on sx pin at the programmed current level. in addition, the operating sx voltage (v sx ) must be higher than the minimum sx voltage (v sx_min ). otherwise, the output current might not be regulated at the programmed level (i sx_set ). the v sx_min is approximately calculated by the following equation: v sx_min = 3000 x i sx_set 2 + 4 (v) for the sop-8 (exposed pad) package, the sx regulated currents are set by the internal bounding wires and depends on the requests of users. for the wqfn-20l 5x5 package, the regulated currents are easily programmed by users. parallel and series operations for improving the utilization of high-voltage leds, the RT7322 is equipped with a proprietary control mechanism which switches the operating mode in either ? parallel operation ? or ? series operation ? . figure 2. timing chart figure 3 shows the current paths in parallel operation. in this operation (during t1 to t3 and t6 to t8), an internal mosfet are turned on to provide a current path from hv to hv1 pins. in this operation, the s1 and s3 regulators is turned on when the input voltage (v hv ) is greater than the led forward voltage (v f ) and smaller than 2 x v f (during t1 to t2 and t7 to t8); the s2 and s4 regulators take over the current regulations when the v hv is approximately larger then 2 x v f and smaller than 3 x v f (during t2 to t3 and t6 to t7). the typical regulated currents are calculated by the following equations: i p_s1/2 = i 10 + i 11 (if i11 = gnd) + i 12 (if i12 = gnd) + i 13 (if i13 = gnd) i p_s3/4 = i 20 + i 21 (if i21 = gnd) + i 22 (if i22 = gnd) + i 23 (if i23 = gnd) (a) (b) figure 3. current paths in parallel operation s3 gnd hv1 s4 hv s1 s2 i p_s3 i p_s1 v hv s3 gnd hv1 s4 hv s1 s2 i p_s4 i p_s2 v hv as the v hv is approximately larger then 3 x v f (during t3 to t6), the series operation is active. figure 4 shows the current paths in series operation. in this operation, the internal mosfet is turned off and a built-in high-voltage diode provides a current path from s2 to hv1 pins. in this operation, the s3 regulator is turned on when the v hv is approximately greater than 3 x v f and smaller than 4 x v f (during t3 to t4 and t5 to t6); the s4 regulator takes over v hv t0 t1 t2 t3 t4 t9 t8 t7 t6 t5 v f 2 x v f 3 x v f 4 x v f
RT7322 7 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. the current regulation when the v hv is approximately larger then 4 x v f (during t4 to t5). the typical regulated currents are calculated by the following equations : i s_s3/4 = i p_s3/4 + i 31 (if i31 = gnd) + i 32 (if i32 = gnd) + i 33 (if i33 = gnd) + i 34 (if i34 = gnd) (a) (b) figure 4. current paths in series operation thermal regulation protection when a led lamp operates in high ambient temperature conditions, it needs a thermal protection to limit the temperatures for protecting led lamps and ensuring system reliability. the RT7322 provides a thermal regulation protection, instead of traditional thermal shutdown, to suppress the rise of temperatures. when the ic junction temperature rise above 140 c (typ.), this function starts to gradually reduce the regulated led current (i s_s3 and i s_s4 ), depending on the rise of the junction temperature. meanwhile, the system power dissipation is also reduced. finally, the temperatures in the system will be well controlled and enter their steady- states. the function can achieve both of the two targets : to protect led lamps and to prevent them from flicker. s3 gnd hv1 s4 hv s1 s2 i s_s3 v hv s3 gnd hv1 s4 hv s1 s2 i s_s4 v hv
RT7322 8 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. absolute maximum ratings (note 1) ? hv to gnd voltage, v hv ------------------------------------------------------------------------------------------------ ? 0.3v to 500v ? hv1 to gnd voltage ----------------------------------------------------------------------------------------------------- ? 0.3v to 500v ? hv to hv1 voltage ------------------------------------------------------------------------------------------------------- ? 0.3v to 300v ? s1, s2 to gnd v oltage (at of f-state) --------------------------------------------------------------------------------- ? 0.3v to 300v ? s3, s4 to gnd v oltage (at of f-state) --------------------------------------------------------------------------------- ? 0.3v to 200v ? s1, s2, s3, s4 to gnd voltage (at on-state) ---------------------------------------------------------------------- ? 0.3v to 100v ? i11, i12, i13, i21, i22, i23, i31, i32, i33, i34 to gnd voltage ---------------------------------------------------- ? 0.3v to 5v ? typical value of progra mmed s1, s2 current --------------------------------------------------------------------- 45ma ? typical value of progra mmed s3, s4 current --------------------------------------------------------------------- 90ma ? power dissipation, p d @ t a = 25 c sop-8 (exposed pad) -------------------------------------------------------------------------------------------------- 3.44w wqfn-20l 5x5 ----------------------------------------------------------------------------------------------------------- 3.54w ? package thermal resistance (note 2) sop-8 (exposed pad), ja --------------------------------------------------------------------------------------------- 29 c/w sop-8 (exposed pad), jc -------------------------------------------------------------------------------------------- 2 c/w wqfn-20l 5x5, ja ------------------------------------------------------------------------------------------------------ 28.2 c/w wqfn-20l 5x5, jc ----------------------------------------------------------------------------------------------------- 7.1 c/w ? junction temperature ---------------------------------------------------------------------------------------------------- 150 c ? lead temperature (soldering, 10 se c.) ------------------------------------------------------------------------------ 260 c ? storage temperature range ------------------------------------------------------------------------------------------- ? 65 c to 150 c ? esd susceptibility (note 3) hbm (human body model), all pin s except hv ------------------------------------------------------------------ 2kv mm (ma chine model) ---------------------------------------------------------------------------------------------------- 200v recommended operating conditions (note 4) ? hv supply voltage, v hv ------------------------------------------------------------------------------------------------ 1 to 200v ? s1, s2, s3, s4 input dc voltage (at on-state) ------------------------------------------------------------------- 1v to 90v (at off-state) ------------------------------------------------------------- ------ 1v to 180v ? typical value of programmed s1, s2 current --------------------------------------------------------------------- 20ma to 45ma ? typical value of programmed s3, s4 current --------------------------------------------------------------------- 20ma to 90ma ? ambient temperature range ------------------------------------------------------------------------------------------- ? 40 c to 85 c ? junction temperature range ------------------------------------------------------------------------------------------- ? 40 c to 125 c
RT7322 9 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. note 1. stresses beyond those listed ? absolute maximum ratings ? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions may affect device reliability. note 2. ja is measured at t a = 25 c on a high effective thermal conductivity four-layer test board per jedec 51-7. jc is measured at the exposed pad of the package. note 3. devices are esd sensitive. handling precaution is recommended. note 4. the device is not guaranteed to function outside its operating conditions. electrical characteristics (t a = 25 c, unless otherwise specification) parameter symbol test conditions min typ max unit output current section initial s1 to s4 regulated current i 10 , i 20 v s1 , v s2 , v s3 , or v s4 = 30v, i11 to i34 = open 19 20 21 ma i 11 v s1 or v s2 = 30v, i 11 = gnd, i12 = i13 = open 4.75 5 5.25 i 12 v s1 or v s2 = 30v, i12 = gnd, i11 = i13 = open 9.5 10 10.5 increment of s1, s2 regulated current i 13 v s1 or v s2 = 30v, i13 = gnd, i11 = i12 = open 19 20 21 ma i 21 v s3 or v s4 = 30v, i21 = gnd, i22 = i23 = open 4.75 5 5.25 i 22 v s3 or v s4 = 30v, i22 = gnd, i21 = i23 = open 9.5 10 10.5 i 23 v s3 or v s4 = 30v, i23 = gnd, i21 = i22 = open 19 20 21 i 31 v s3 or v s4 = 30v, i31 = gnd, i32 = i33 = i34 = open 4.75 5 5.25 i 32 v s3 or v s4 = 30v, i32 = gnd, i31 = i33 = i34 = open 9.5 10 10.5 i 33 v s3 or v s4 = 30v, i33 = gnd, i31 = i32 = i34 = open 19 20 21 increment of s3, s4 regulated current i 34 v s3 or v s4 = 30v, i34 = gnd, i31 = i32 = i33 = open 38 40 42 ma off-state leakage currents s1 leakage current v s2 = 20v, v s1 = 300v -- -- 300 ? a s2 leakage current v s2 = 300v -- -- 300 ? a s3 leakage current v s4 = 20v, v s3 = 200v -- -- 300 ? a current capability hv-to-hv1 current v hv = 5v, v hv 1 = 0v 80 -- -- ma s2-to-hv1 current v s2 = 1.2v, v hv1 = 0v 60 -- -- ma
RT7322 10 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. typical application circuit figure 5. for sop-8 (exposed pad) package figure 6. for wdfn-20l 5x5 package figure 7. 24w to 25w output power application s3 gnd RT7322 hv1 ac s4 hv s1 s2 1 4, 9 (exposed pad) 2 3 8 7 6 mov 7n221u x-cap r rse s3 gnd RT7322 hv1 ac s4 hv s1 s2 mov 7n221u x-cap s3 gnd RT7322 hv1 s4 hv s1 s2 s3 gnd RT7322 hv1 s4 hv s1 s2 s3 gnd RT7322 hv1 s4 hv s1 s2 r rse s3 i32 RT7322 hv1 s4 hv s1 s2 i11 i12 i13 i23 i22 i31 i33 i34 i21 mov 7n221u x-cap ac 9 1 7 8 10 11 12 13 16 15 14 18 17 19 1 20 r rse 21 (exposed pad) gnd
RT7322 11 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. figure 8. derating curve of maximum power dissipation application information thermal considerations for continuous operation, do not exceed absolute maximum junction temperature. the maximum power dissipation depends on the thermal resistance of the ic package, pcb layout, rate of surrounding airflow, and difference between junction and ambient temperature. the maximum power dissipation can be calculated by the following formula : p d(max) = (t j(max) ? t a ) / ja where t j(max) is the maximum junction temperature, t a is the ambient temperature, and ja is the junction to ambient thermal resistance. for recommended operating condition specifications, the maximum junction temperature is 125 c. the junction to ambient thermal resistance, ja , is layout dependent. for sop-8 (exposed pad) package, the thermal resistance, ja , is 29 c/w on a standard jedec 51-7 four-layer thermal test board. for wqfn-20l 5x5 package, the thermal resistance, ja , is 28.2 c/w on a standard jedec 51-7 four-layer thermal test board. the maximum power dissipation at t a = 25 c can be calculated by the following formula : p d(max) = (125 c ? 25 c) / (29 c/w) = 3.44w for sop-8 (exposed pad) package p d(max) = (125 c ? 25 c) / (28.2 c/w) = 3.54w for wqfn-20l 5x5 package the maximum power dissipation depends on the operating ambient temperature for fixed t j(max) and thermal resistance, ja . the derating curve in figure 8 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. layout considerations ? the thermal resistance ja of sop-8 (exposed pad) or wqfn-20l 5x5 is determined by the package design and the pcb design. however, the package design had been designed. if possible, it's useful to increase thermal performance by the pcb design. the thermal resistance ja can be decreased by adding a copper under the exposed pad of sop-8 (exposed pad) or wqfn-20l 5x5 package. the exposed pad can be connected the ground or an isolated plane on the pcb. ? the used current setting pins (i11 to i33) must be directly connect to gnd pin with shortest copper paths. not- used current setting pins (i11 to i33) must be kept open. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 ambient temperature (c) maximum power dissipation (w) 1 four-layer pcb wdfn-20l 5x5 sop-8 (exposed pad)
RT7322 12 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. selection guide of the RT7322 in the sop-8 (exposed pad) package the s1 to s4 sinking current of the RT7322 in the sop-8 (exposed pad) package depends on the requests of users and set by the internal bounding wires. in the ? parallel operation ? , the led current range can be set from 20ma to 45ma; in thea ? series operation ? , the led current range can be set from 20ma to 90ma. the following table shows the selection guide of the RT7322 in the sop-8 (exposed pad) package for the applications with input power from 5w to 7w. input power parallel current series current ordering information 5w 30ma 50ma RT7322cggsp 6w 30ma 65ma RT7322cjgsp 6.6w 30ma 70ma RT7322ckgsp 7w 40ma 75ma RT7322elgsp
RT7322 13 ds7322-00 march 2014 www.richtek.com ? copyright 2014 richtek technology corporation. all rights reserved. is a registered trademark of ric htek technology corporation. outline dimension w-type 20l qfn 5x5 package min. max. min. max. a 0.700 0.800 0.028 0.031 a1 0.000 0.050 0.000 0.002 a3 0.175 0.250 0.007 0.010 b 0.250 0.350 0.010 0.014 d 4.900 5.100 0.193 0.201 d2 3.100 3.200 0.122 0.126 e 4.900 5.100 0.193 0.201 e2 3.100 3.200 0.122 0.126 e l 0.500 0.600 0.020 0.024 symbol dimensions in millimeters dimensions in inches 0.650 0.026 note : the configuration of the pin #1 identifier is optional, but must be located within the zone indicated. det ail a pin #1 id and tie bar mark options 1 1 2 2
RT7322 14 ds7322-00 march 2014 www.richtek.com richtek technology corporation 14f, no. 8, tai yuen 1 st street, chupei city hsinchu, taiwan, r.o.c. tel: (8863)5526789 richtek products are sold by description only. richtek reserves the right to change the circuitry and/or specifications without notice at any time. customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a richtek product. information furnish ed by richtek is believed to be accurate and reliable. however, no responsibility is assumed by richtek or its subsidiaries for its use; nor for any infringeme nts of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of r ichtek or its subsidiaries. a b j f h m c d i y x exposed thermal pad (bottom of package) 8-lead sop (exposed pad) plastic package dimensions in millimeters dimensions in inches symbol min max min max a 4.801 5.004 0.189 0.197 b 3.810 4.000 0.150 0.157 c 1.346 1.753 0.053 0.069 d 0.330 0.510 0.013 0.020 f 1.194 1.346 0.047 0.053 h 0.170 0.254 0.007 0.010 i 0.000 0.152 0.000 0.006 j 5.791 6.200 0.228 0.244 m 0.406 1.270 0.016 0.050 x 2.000 2.300 0.079 0.091 option 1 y 2.000 2.300 0.079 0.091 x 2.100 2.500 0.083 0.098 option 2 y 3.000 3.500 0.118 0.138

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